Internationally recognized for his innovative work in the fields of scanning and transmission electron microscopy applied to semiconductors and metallic alloys, thin film nanostructures and failure analysis, Douglas Perovic is in the midst of an outstanding career as Chair, Department of Materials Science and Engineering, University of Toronto. He led the creation of the multi-industry, multi-university Centre for Microelectronics Assembly and Packaging based in Ontario. With over 150 refereed publications and 5 patents, Douglas Perovic has created new fundamental knowledge and applied it to understanding the failure of engineered structures through over 100 forensic analyses. He has explained his work in many media interviews and articles in magazines and newspapers.